Fabrication of Novel Geopolymer Reinforced Tin Copper Solder in Suppressing Intermetallic Layer Growth

Copper/solder intermetallic growth studies.

Copper samples, hot solder (eutectic) dipped and thermally aged, were cross-sectioned and placed in an environmental scanning electronic microscope (ESEM). While in the ESEM the samples were heated for approximately 2.5 h at 170 degrees C to stimulate the growth of additional Cu/Sn intermetallic compound. The intent of the study was to obtain a continuous real-time videotape record of the diffu...

Review of the Impact of Intermetallic Layers on the Brittleness of Tin-Lead and Lead-Free Solder Joints

Investigation of microstructure and physical properties in nanocomposite solder reinforced with various percent of graphene nanosheets (SAC0307+GNSs)

Development of electronic industries, compression of electronic equipment, and removing lead from electronic circuits for environmental issues, resulted in a significant challenge in design and development of tin-based lead-free solders with physical and mechanical properties similar to old tin-lead alloys. In this regard, the set of Sn-Ag-Cu alloys with eutectic and near eutectic compositions ...

Investigation of microstructure and physical properties in nanocomposite solder reinforced with various percent of graphene nanosheets (SAC0307+GNSs)

Development of electronic industries, compression of electronic equipment, and removing lead from electronic circuits for environmental issues, resulted in a significant challenge in design and development of tin-based lead-free solders with physical and mechanical properties similar to old tin-lead alloys. In this regard, the set of Sn-Ag-Cu alloys with eutectic and near eutectic compositions ...

Microstructural development in a rapidly cooled eutectic Sn–3.5% Ag solder reinforced with copper powder

Experiments using eutectic Sn–3.5% Ag solder paste were conducted with the objective of examining the conjoint influence of copper particles addition and rapid cooling on microstructural development. The composite solder mixture was made by thoroughly mixing a pre-weighed amount of copper particles with a commercial Sn–3.5% Ag solder paste. The experiments were quite similar to the heating and ...